74ABT74DB
vs
74LCX74BQX
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
ONSEMI
|
Package Description |
SSOP, SSOP14,.3
|
DQFN-14
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
R-PDSO-G14
|
R-XQCC-N14
|
Load Capacitance (CL) |
50 pF
|
50 pF
|
Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
Max Frequency@Nom-Sup |
150000000 Hz
|
|
Max I(ol) |
0.02 A
|
0.024 A
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
2
|
2
|
Number of Terminals |
14
|
14
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
Package Code |
SSOP
|
HVQCCN
|
Package Equivalence Code |
SSOP14,.3
|
LCC14,.1X.12,20
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, SHRINK PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Prop. Delay@Nom-Sup |
4.7 ns
|
7 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Nom (Vsup) |
5 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
GULL WING
|
NO LEAD
|
Terminal Pitch |
0.635 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
QUAD
|
Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
Base Number Matches |
3
|
2
|
Pbfree Code |
|
Yes
|
Part Package Code |
|
QFN-14
|
Manufacturer Package Code |
|
510CB
|
Factory Lead Time |
|
2 Days
|
Samacsys Manufacturer |
|
onsemi
|
Family |
|
LVC/LCX/Z
|
JESD-609 Code |
|
e4
|
Length |
|
3 mm
|
Number of Bits |
|
1
|
Output Polarity |
|
COMPLEMENTARY
|
Packing Method |
|
TR
|
Propagation Delay (tpd) |
|
8.4 ns
|
Seated Height-Max |
|
0.8 mm
|
Supply Voltage-Max (Vsup) |
|
3.6 V
|
Supply Voltage-Min (Vsup) |
|
2 V
|
Technology |
|
CMOS
|
Terminal Finish |
|
NICKEL PALLADIUM GOLD
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
Width |
|
2.5 mm
|
fmax-Min |
|
150 MHz
|
|
|
|