74ABT541D,623
vs
SN74LS373JDS
feature comparison
All Stats
Differences Only
Rohs Code
Yes
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
MOTOROLA INC
Part Package Code
SOP
Pin Count
20
Manufacturer Package Code
SOT163-1
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
WITH DUAL OUTPUT ENABLE
Control Type
ENABLE LOW
Family
ABT
LS
JESD-30 Code
R-PDSO-G20
R-CDIP-T20
JESD-609 Code
e4
e0
Length
12.8 mm
24.515 mm
Load Capacitance (CL)
50 pF
Logic IC Type
BUS DRIVER
BUS DRIVER
Max I(ol)
0.064 A
Moisture Sensitivity Level
1
Number of Bits
8
8
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
20
20
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
SOP
DIP
Package Equivalence Code
SOP20,.4
DIP20,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Power Supply Current-Max (ICC)
30 mA
Prop. Delay@Nom-Sup
4.6 ns
Propagation Delay (tpd)
4.6 ns
30 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.65 mm
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
5.25 V
Supply Voltage-Min (Vsup)
4.5 V
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
BICMOS
TTL
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
TIN LEAD
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
7.5 mm
7.62 mm
Base Number Matches
1
1
Package Description
DIP, DIP20,.3
Compare 74ABT541D,623 with alternatives
Compare SN74LS373JDS with alternatives