74ABT541D,623 vs SN74LS373JDS feature comparison

74ABT541D,623 NXP Semiconductors

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SN74LS373JDS Motorola Semiconductor Products

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA INC
Part Package Code SOP
Pin Count 20
Manufacturer Package Code SOT163-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature WITH DUAL OUTPUT ENABLE
Control Type ENABLE LOW
Family ABT LS
JESD-30 Code R-PDSO-G20 R-CDIP-T20
JESD-609 Code e4 e0
Length 12.8 mm 24.515 mm
Load Capacitance (CL) 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Max I(ol) 0.064 A
Moisture Sensitivity Level 1
Number of Bits 8 8
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 20 20
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code SOP DIP
Package Equivalence Code SOP20,.4 DIP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Packing Method TR
Peak Reflow Temperature (Cel) 260
Power Supply Current-Max (ICC) 30 mA
Prop. Delay@Nom-Sup 4.6 ns
Propagation Delay (tpd) 4.6 ns 30 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.65 mm 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V 5.25 V
Supply Voltage-Min (Vsup) 4.5 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology BICMOS TTL
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) TIN LEAD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 7.5 mm 7.62 mm
Base Number Matches 1 1
Package Description DIP, DIP20,.3

Compare 74ABT541D,623 with alternatives

Compare SN74LS373JDS with alternatives