741X163910JP
vs
TSN3ATJ910V
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
CTS CORP
|
TATEYAMA KAGAKU GROUP
|
Package Description |
CHIP, ROHS COMPLIANT
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8533.21.00.20
|
|
Construction |
Rectangular
|
Chip
|
Element Power Dissipation |
0.063 W
|
|
First Element Resistance |
91 Ω
|
|
JESD-609 Code |
e3
|
|
Mounting Feature |
SURFACE MOUNT
|
|
Network Type |
ISOLATED
|
ISOLATED
|
Number of Elements |
1
|
|
Number of Functions |
8
|
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Package Height |
0.45 mm
|
0.45 mm
|
Package Length |
1.6 mm
|
3.8 mm
|
Package Shape |
RECTANGULAR PACKAGE
|
|
Package Style |
SMT
|
SMT
|
Package Width |
3.95 mm
|
1.6 mm
|
Packing Method |
TR, PAPER, 7 INCH
|
Tape
|
Rated Power Dissipation (P) |
0.504 W
|
0.063 W
|
Rated Temperature |
70 °C
|
|
Reference Standard |
AEC-Q200
|
|
Resistance |
91 Ω
|
91 Ω
|
Resistor Type |
ARRAY/NETWORK RESISTOR
|
ARRAY/NETWORK RESISTOR
|
Second/Last Element Resistance |
91 Ω
|
|
Size Code |
0616
|
1506
|
Surface Mount |
YES
|
|
Technology |
METAL GLAZE/THICK FILM
|
METAL GLAZE/THICK FILM
|
Temperature Coefficient |
200 ppm/°C
|
200 ppm/°C
|
Terminal Finish |
Matte Tin (Sn) - with Nickel (Ni) barrier
|
|
Terminal Shape |
WRAPAROUND
|
|
Tolerance |
5%
|
5%
|
Working Voltage |
25 V
|
25 V
|
Base Number Matches |
2
|
1
|
|
|
|
Compare 741X163910JP with alternatives
Compare TSN3ATJ910V with alternatives