72V811L15PFI
vs
IDT72811L15PFI9
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
TQFP
QFP
Package Description
PLASTIC, TQFP-64
TQFP-64
Pin Count
64
64
Manufacturer Package Code
PN64
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
kg CO2e/kg
12.3
12.3
Average Weight (mg)
267.8
267.8
CO2e (mg)
3293.94
3293.94
Total Weight
616
Category CO2 Kg
12.3
12.3
CO2
7576.8
Compliance Temperature Grade
Industrial: -40C to +85C
Industrial: -40C to +85C
Candidate List Date
2024-01-23
2013-06-20
SVHC Over MCV
7439-92-1
CAS Accounted for Wt
92
CA Prop 65 Presence
YES
CA Prop 65 CAS Numbers
7439-92-1
Conflict Mineral Status
DRC Conflict Free
DRC Conflict Free
Conflict Mineral Status Source
CMRT V5.00
CMRT V3.02
Access Time-Max
10 ns
10 ns
Clock Frequency-Max (fCLK)
66.7 MHz
Cycle Time
15 ns
15 ns
JESD-30 Code
S-PQFP-G64
S-PQFP-G64
JESD-609 Code
e0
e0
Length
14 mm
14 mm
Memory Density
4608 bit
4608 bit
Memory IC Type
OTHER FIFO
OTHER FIFO
Memory Width
9
9
Moisture Sensitivity Level
3
3
Number of Functions
1
2
Number of Terminals
64
64
Number of Words
512 words
512 words
Number of Words Code
512
512
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
512X9
512X9
Output Enable
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LQFP
LQFP
Package Equivalence Code
QFP64,.66SQ,32
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE
FLATPACK, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
240
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
1.6 mm
Standby Current-Max
0.01 A
Supply Current-Max
0.04 mA
0.06 mA
Supply Voltage-Max (Vsup)
3.6 V
5.5 V
Supply Voltage-Min (Vsup)
3 V
4.5 V
Supply Voltage-Nom (Vsup)
3.3 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
NOT SPECIFIED
Width
14 mm
14 mm
Base Number Matches
1
1
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