72V3640L6PFG
vs
72V3640L6BBG
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
RENESAS ELECTRONICS CORP
INTEGRATED DEVICE TECHNOLOGY INC
Package Description
TQFP-128
BGA-144
Reach Compliance Code
compliant
compliant
Access Time-Max
4 ns
4 ns
Additional Feature
RETRANSMIT; AUTO POWER DOWN; ASYNCHRONOUS MODE IS ALSO POSSIBLE
RETRANSMIT; AUTO POWER DOWN; ASYNCHRONOUS MODE IS ALSO POSSIBLE
Clock Frequency-Max (fCLK)
166 MHz
166 MHz
Cycle Time
6 ns
6 ns
JESD-30 Code
R-PQFP-G128
S-PBGA-B144
JESD-609 Code
e3
e1
Length
20 mm
13 mm
Memory Density
36864 bit
36864 bit
Memory IC Type
OTHER FIFO
OTHER FIFO
Memory Width
36
36
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
128
144
Number of Words
1024 words
1024 words
Number of Words Code
1000
1000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
1KX36
1KX36
Output Enable
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFQFP
BGA
Package Equivalence Code
QFP128,.63X.87,20
BGA144,12X12,40
Package Shape
RECTANGULAR
SQUARE
Package Style
FLATPACK, LOW PROFILE, FINE PITCH
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
1.97 mm
Standby Current-Max
0.015 A
0.015 A
Supply Current-Max
0.04 mA
0.04 mA
Supply Voltage-Max (Vsup)
3.45 V
3.45 V
Supply Voltage-Min (Vsup)
3.15 V
3.15 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Matte Tin (Sn) - annealed
TIN SILVER COPPER
Terminal Form
GULL WING
BALL
Terminal Pitch
0.5 mm
1 mm
Terminal Position
QUAD
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
40
Width
14 mm
13 mm
Base Number Matches
2
2
Pbfree Code
Part Package Code
BGA
Pin Count
144
ECCN Code
EAR99
HTS Code
8542.32.00.71
Compare 72V3640L6PFG with alternatives
Compare 72V3640L6BBG with alternatives