72V295L15PFGI
vs
72V295L15PFG8
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Package Description |
TQFP-64
|
LQFP,
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.71
|
8542.32.00.71
|
| Access Time-Max |
10 ns
|
10 ns
|
| Additional Feature |
RETRANSMIT; AUTO POWER DOWN
|
EASILY EXPANDABLE IN DEPTH AND WIDTH
|
| Cycle Time |
15 ns
|
15 ns
|
| JESD-30 Code |
S-PQFP-G64
|
S-PQFP-G64
|
| Memory Density |
2359296 bit
|
2359296 bit
|
| Memory Width |
18
|
18
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
64
|
64
|
| Number of Words |
131072 words
|
131072 words
|
| Number of Words Code |
128000
|
128000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
128KX18
|
128KX18
|
| Output Enable |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QFP
|
LQFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK
|
FLATPACK, LOW PROFILE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Base Number Matches |
2
|
1
|
| Length |
|
14 mm
|
| Seated Height-Max |
|
1.6 mm
|
| Terminal Pitch |
|
0.8 mm
|
| Width |
|
14 mm
|
|
|
|
Compare 72V295L15PFGI with alternatives
Compare 72V295L15PFG8 with alternatives