72V271LA10TFG8
vs
72271LA10PFG
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Package Description |
TQFP-64
|
TQFP-64
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.71
|
8542.32.00.71
|
| Access Time-Max |
6.5 ns
|
8 ns
|
| Additional Feature |
RETRANSMIT
|
RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH
|
| Cycle Time |
10 ns
|
10 ns
|
| JESD-30 Code |
S-PQFP-G64
|
S-PQFP-G64
|
| Length |
10 mm
|
14 mm
|
| Memory Density |
294912 bit
|
294912 bit
|
| Memory Width |
9
|
9
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
64
|
64
|
| Number of Words |
32768 words
|
32768 words
|
| Number of Words Code |
32000
|
32000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
32KX9
|
32KX9
|
| Output Enable |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFQFP
|
LQFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
FLATPACK, LOW PROFILE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Seated Height-Max |
1.6 mm
|
1.6 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.8 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
10 mm
|
14 mm
|
| Base Number Matches |
2
|
4
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
TQFP
|
| Pin Count |
|
64
|
| Manufacturer Package Code |
|
PNG64
|
| Date Of Intro |
|
1994-01-01
|
| Clock Frequency-Max (fCLK) |
|
100 MHz
|
| JESD-609 Code |
|
e3
|
| Memory IC Type |
|
OTHER FIFO
|
| Moisture Sensitivity Level |
|
3
|
| Package Equivalence Code |
|
QFP64,.66SQ,32
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| Standby Current-Max |
|
0.02 A
|
| Supply Current-Max |
|
0.075 mA
|
| Terminal Finish |
|
MATTE TIN
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare 72V271LA10TFG8 with alternatives
Compare 72271LA10PFG with alternatives