72V261LA15TFGI
vs
72V261LA15TFGI8
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
QFP
Package Description
LFQFP, QFP64,.47SQ,20
TQFP-64
Pin Count
64
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
10 ns
10 ns
Additional Feature
RETRANSMIT
RETRANSMIT
Clock Frequency-Max (fCLK)
66.7 MHz
Cycle Time
15 ns
15 ns
JESD-30 Code
S-PQFP-G64
S-PQFP-G64
JESD-609 Code
e3
Length
10 mm
10 mm
Memory Density
147456 bit
147456 bit
Memory IC Type
OTHER FIFO
Memory Width
9
9
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
64
64
Number of Words
16384 words
16384 words
Number of Words Code
16000
16000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
16KX9
16KX9
Output Enable
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFQFP
LFQFP
Package Equivalence Code
QFP64,.47SQ,20
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE, FINE PITCH
FLATPACK, LOW PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Seated Height-Max
1.6 mm
1.6 mm
Standby Current-Max
0.02 A
Supply Current-Max
0.055 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Matte Tin (Sn) - annealed
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
Width
10 mm
10 mm
Base Number Matches
1
1
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Compare 72V261LA15TFGI8 with alternatives