72V235L15TFGI8 vs 72235LB15PFI9 feature comparison

72V235L15TFGI8 Integrated Device Technology Inc

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72235LB15PFI9 Integrated Device Technology Inc

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code TQFP QFP
Package Description STQFP-64 PLASTIC, TQFP-64
Pin Count 64 64
Manufacturer Package Code PPG64
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Date Of Intro 1992-01-01
Access Time-Max 10 ns 50 ns
Cycle Time 15 ns 65 ns
JESD-30 Code S-PQFP-G64 S-PQFP-G64
JESD-609 Code e3 e0
Length 10 mm 14 mm
Memory Density 36864 bit 9216 bit
Memory Width 18 9
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 64 64
Number of Words 2048 words 2048 words
Number of Words Code 2000 1000
Operating Mode SYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 2KX18 1KX9
Output Enable YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP LQFP
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Seated Height-Max 1.6 mm 1.6 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 3.3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.8 mm
Terminal Position QUAD QUAD
Width 10 mm 14 mm
Base Number Matches 2 2
Memory IC Type OTHER FIFO
Qualification Status Not Qualified
Supply Current-Max 0.08 mA
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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Compare 72235LB15PFI9 with alternatives