72V231L15JGI8 vs IDT72V231L15JG8 feature comparison

72V231L15JGI8 Integrated Device Technology Inc

Buy Now Datasheet

IDT72V231L15JG8 Integrated Device Technology Inc

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Package Description QCCJ, QCCJ,
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 10 ns 10 ns
Cycle Time 15 ns 15 ns
JESD-30 Code R-PQCC-J32 R-PQCC-J32
JESD-609 Code e3 e3
Length 13.9954 mm 13.9954 mm
Memory Density 18432 bit 18432 bit
Memory Width 9 9
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 2048 words 2048 words
Number of Words Code 2000 2000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 2KX9 2KX9
Output Enable YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260
Seated Height-Max 3.556 mm 3.55 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish Matte Tin (Sn) - annealed MATTE TIN
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 11.4554 mm 11.4554 mm
Base Number Matches 2 1
Pbfree Code Yes
Part Package Code QFJ
Pin Count 32
Qualification Status Not Qualified

Compare 72V231L15JGI8 with alternatives

Compare IDT72V231L15JG8 with alternatives