72V231L10JG8
vs
IDT72V23110PFG
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Package Description
QCCJ,
LQFP,
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
6.5 ns
6.5 ns
Cycle Time
10 ns
10 ns
JESD-30 Code
R-PQCC-J32
S-PQFP-G32
JESD-609 Code
e3
e3
Length
13.9954 mm
7 mm
Memory Density
18432 bit
18432 bit
Memory Width
9
9
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
2048 words
2048 words
Number of Words Code
2000
2000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
2KX9
2KX9
Output Enable
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
LQFP
Package Shape
RECTANGULAR
SQUARE
Package Style
CHIP CARRIER
FLATPACK, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
Seated Height-Max
3.556 mm
1.6 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Matte Tin (Sn) - annealed
MATTE TIN
Terminal Form
J BEND
GULL WING
Terminal Pitch
1.27 mm
0.8 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
Width
11.4554 mm
7 mm
Base Number Matches
2
1
Pbfree Code
Part Package Code
QFP
Pin Count
32
Memory IC Type
OTHER FIFO
Qualification Status
Not Qualified
Supply Current-Max
0.02 mA
Compare 72V231L10JG8 with alternatives
Compare IDT72V23110PFG with alternatives