72V2113L7-5BCG vs 72V2113L6BCG8 feature comparison

72V2113L7-5BCG Integrated Device Technology Inc

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72V2113L6BCG8 Integrated Device Technology Inc

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Rohs Code Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Package Description BGA, LBGA,
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 5 ns 4 ns
Additional Feature AUTO POWER DOWN; RETRANSMIT; IT CAN ALSO BE CONFIGURED AS 512K X 9; ASYNCHRONOUS MODE ALSO POSSIBLE ALTERNATIVE MEMORY WIDTH 9; ASYNCHRONOUS MODE ALSO POSSIBLE
Cycle Time 7.5 ns 6 ns
JESD-30 Code S-PBGA-B100 S-PBGA-B100
JESD-609 Code e1
Memory Density 4718592 bit 4718592 bit
Memory Width 18 18
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 100 100
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 256KX18 256KX18
Output Enable YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260
Supply Voltage-Max (Vsup) 3.45 V 3.45 V
Supply Voltage-Min (Vsup) 3.15 V 3.15 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Base Number Matches 1 1
Length 11 mm
Seated Height-Max 1.5 mm
Terminal Pitch 1 mm
Width 11 mm

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