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72V2113L7-5BC vs IDT72V2113L7-5BCG feature comparison

72V2113L7-5BC Renesas Electronics Corporation

Buy Now Datasheet

IDT72V2113L7-5BCG Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer RENESAS ELECTRONICS CORP INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code CABGA BGA
Package Description 11 X 11 MM, 1 MM PITCH, BGA-100 LBGA, BGA100,10X10,40
Pin Count 100 100
Manufacturer Package Code BC100
Reach Compliance Code not_compliant compliant
ECCN Code NLR EAR99
HTS Code 8542320071 8542.32.00.71
Factory Lead Time 18 Weeks
Samacsys Manufacturer Renesas Electronics
Access Time-Max 5 ns 5 ns
Additional Feature ALTERNATIVE MEMORY WIDTH 9; ASYNCHRONOUS MODE ALSO POSSIBLE ALTERNATIVE MEMORY WIDTH 9; ASYNCHRONOUS MODE ALSO POSSIBLE
Alternate Memory Width 9 9
Clock Frequency-Max (fCLK) 133.3 MHz 133.3 MHz
Cycle Time 7.5 ns 7.5 ns
JESD-30 Code S-PBGA-B100 S-PBGA-B100
JESD-609 Code e0 e1
Length 11 mm 11 mm
Memory Density 4718592 bit 4718592 bit
Memory IC Type OTHER FIFO OTHER FIFO
Memory Width 18 18
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 100 100
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 256KX18 256KX18
Output Enable YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA100,10X10,40 BGA100,10X10,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 225 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.5 mm 1.5 mm
Standby Current-Max 0.015 A 0.015 A
Supply Current-Max 0.035 mA 0.035 mA
Supply Voltage-Max (Vsup) 3.45 V 3.45 V
Supply Voltage-Min (Vsup) 3.15 V 3.15 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 11 mm 11 mm
Base Number Matches 4 4
Memory » FIFOs
Memory » FIFOs

Compare 72V2113L7-5BC with alternatives

Compare IDT72V2113L7-5BCG with alternatives