72V205L15TFGI8
vs
72V205L15TFG8
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Reach Compliance Code |
compliant
|
compliant
|
| Access Time-Max |
10 ns
|
10 ns
|
| Cycle Time |
15 ns
|
15 ns
|
| JESD-30 Code |
S-PQFP-G64
|
S-PQFP-G64
|
| Length |
10 mm
|
10 mm
|
| Memory Density |
4608 bit
|
4608 bit
|
| Memory IC Type |
OTHER FIFO
|
|
| Memory Width |
18
|
18
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
64
|
64
|
| Number of Words |
256 words
|
256 words
|
| Number of Words Code |
256
|
256
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
256X18
|
256X18
|
| Output Enable |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFQFP
|
LFQFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
1.6 mm
|
1.6 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
10 mm
|
10 mm
|
| Base Number Matches |
1
|
1
|
| Package Description |
|
LFQFP,
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.32.00.71
|
| Additional Feature |
|
EASILY EXPANDABLE IN DEPTH AND WIDTH
|
|
|
|
Compare 72V205L15TFGI8 with alternatives
Compare 72V205L15TFG8 with alternatives