72V04L25JI
vs
IDT72V04L25JG
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
PLCC
QFJ
Package Description
PLASTIC, LCC-32
QCCJ, LDCC32,.5X.6
Pin Count
32
32
Manufacturer Package Code
PL32
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
25 ns
25 ns
Clock Frequency-Max (fCLK)
28.5 MHz
28.5 MHz
Cycle Time
35 ns
35 ns
JESD-30 Code
R-PQCC-J32
R-PQCC-J32
JESD-609 Code
e0
e3
Length
13.9954 mm
Memory Density
36864 bit
36864 bit
Memory IC Type
OTHER FIFO
OTHER FIFO
Memory Width
9
9
Moisture Sensitivity Level
1
3
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
4096 words
4096 words
Number of Words Code
4000
4000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
4KX9
4KX9
Output Enable
NO
NO
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
QCCJ
Package Equivalence Code
LDCC32,.5X.6
LDCC32,.5X.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
225
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.556 mm
Standby Current-Max
0.0003 A
0.005 A
Supply Current-Max
0.05 mA
0.06 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Matte Tin (Sn) - annealed
Terminal Form
J BEND
J BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
20
30
Width
11.4554 mm
Base Number Matches
1
1
Additional Feature
RETRANSMIT
Compare 72V04L25JI with alternatives
Compare IDT72V04L25JG with alternatives