72V04L25JG vs IDT72V04L25J feature comparison

72V04L25JG Integrated Device Technology Inc

Buy Now Datasheet

IDT72V04L25J Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFJ QFJ
Package Description QCCJ, PLASTIC, LCC-32
Pin Count 32 32
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 25 ns 25 ns
Additional Feature RETRANSMIT RETRANSMIT
Cycle Time 35 ns 35 ns
JESD-30 Code R-PQCC-J32 R-PQCC-J32
JESD-609 Code e3 e0
Memory Density 36864 bit 36864 bit
Memory Width 9 9
Moisture Sensitivity Level 3 1
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 4096 words 4096 words
Number of Words Code 4000 4000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 4KX9 4KX9
Output Enable NO NO
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 225
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Matte Tin (Sn) - annealed Tin/Lead (Sn85Pb15)
Terminal Form J BEND J BEND
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 20
Base Number Matches 1 1
Clock Frequency-Max (fCLK) 28.5 MHz
Length 13.9954 mm
Memory IC Type OTHER FIFO
Output Characteristics 3-STATE
Package Equivalence Code LDCC32,.5X.6
Seated Height-Max 3.556 mm
Standby Current-Max 0.0003 A
Supply Current-Max 0.05 mA
Terminal Pitch 1.27 mm
Width 11.4554 mm

Compare 72V04L25JG with alternatives

Compare IDT72V04L25J with alternatives