72T631S12BFG
vs
70T633S10BFG8
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
BGA
CABGA
Package Description
BGA,
FBGA-208
Pin Count
208
208
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
12 ns
10 ns
JESD-30 Code
R-PBGA-B208
S-PBGA-B208
JESD-609 Code
e1
e1
Memory Density
4718592 bit
9437184 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
18
18
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
208
208
Number of Words
262144 words
524288 words
Number of Words Code
256000
512000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
256KX18
512KX18
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
RECTANGULAR
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
2.6 V
2.6 V
Supply Voltage-Min (Vsup)
2.4 V
2.4 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN SILVER COPPER
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Position
BOTTOM
BOTTOM
Base Number Matches
1
2
Manufacturer Package Code
BFG208
I/O Type
COMMON
Number of Ports
2
Output Characteristics
3-STATE
Package Equivalence Code
BGA208,17X17,32
Peak Reflow Temperature (Cel)
260
Standby Current-Max
0.01 A
Standby Voltage-Min
2.4 V
Supply Current-Max
0.405 mA
Terminal Pitch
0.8 mm
Time@Peak Reflow Temperature-Max (s)
30
Compare 72T631S12BFG with alternatives
Compare 70T633S10BFG8 with alternatives