72T1885L10BBG
vs
IDT72T1885L4-4BB
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
BGA,
13 X 13 MM, 1 MM PITCH, PLASTIC, BGA-144
Pin Count
144
144
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
4.5 ns
3.4 ns
Additional Feature
ALTERNATIVE MEMORY WIDTH 9; ASYNCHRONOUS OPERATION ALSO POSSIBLE
ALTERNATIVE MEMORY WIDTH 9; ASYNCHRONOUS OPERATION ALSO POSSIBLE
Cycle Time
10 ns
4.44 ns
JESD-30 Code
S-PBGA-B144
S-PBGA-B144
JESD-609 Code
e1
e0
Length
13 mm
13 mm
Memory Density
589824 bit
589824 bit
Memory Width
18
18
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
144
144
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
32KX18
32KX18
Output Enable
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.97 mm
1.97 mm
Supply Voltage-Max (Vsup)
2.625 V
2.625 V
Supply Voltage-Min (Vsup)
2.375 V
2.375 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN SILVER COPPER
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
13 mm
13 mm
Base Number Matches
1
1
Alternate Memory Width
9
Clock Frequency-Max (fCLK)
100 MHz
Memory IC Type
OTHER FIFO
Package Equivalence Code
BGA144,12X12,40
Peak Reflow Temperature (Cel)
225
Standby Current-Max
0.05 A
Supply Current-Max
0.06 mA
Time@Peak Reflow Temperature-Max (s)
30
Compare 72T1885L10BBG with alternatives
Compare IDT72T1885L4-4BB with alternatives