72P51749L6BB8 vs IDT72P51549L6BB feature comparison

72P51749L6BB8 Integrated Device Technology Inc

Buy Now Datasheet

IDT72P51549L6BB Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code PBGA
Package Description BGA, BGA256,16X16,40
Pin Count 256
Manufacturer Package Code BB256
Reach Compliance Code not_compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 3.7 ns 3.7 ns
Clock Frequency-Max (fCLK) 166 MHz 166 MHz
Cycle Time 6 ns
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e0 e0
Length 17 mm
Memory Density 1179648 bit 1179648 bit
Memory IC Type OTHER FIFO OTHER FIFO
Memory Width 36 36
Moisture Sensitivity Level 3 3
Number of Functions 1
Number of Terminals 256 256
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode SYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 32KX36 32KX36
Output Enable YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA256,16X16,40 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 225 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.5 mm
Standby Current-Max 0.1 A 0.1 A
Supply Current-Max 0.15 mA 0.15 mA
Supply Voltage-Max (Vsup) 1.9 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 17 mm
Base Number Matches 1 1

Compare 72P51749L6BB8 with alternatives

Compare IDT72P51549L6BB with alternatives