7284L12PAGI
vs
7284L12PAG
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
TSSOP
|
TSSOP
|
| Package Description |
GREEN, TSSOP-56
|
TSSOP-56
|
| Pin Count |
56
|
56
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.71
|
8542.32.00.71
|
| Access Time-Max |
15 ns
|
12 ns
|
| Additional Feature |
RETRANSMIT
|
RETRANSMIT
|
| Cycle Time |
25 ns
|
20 ns
|
| JESD-30 Code |
R-PDSO-G56
|
R-PDSO-G56
|
| JESD-609 Code |
e3
|
e3
|
| Length |
14 mm
|
14 mm
|
| Memory Density |
36864 bit
|
36864 bit
|
| Memory Width |
9
|
9
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
56
|
56
|
| Number of Words |
4096 words
|
4096 words
|
| Number of Words Code |
4000
|
4000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
4KX9
|
4KX9
|
| Output Enable |
NO
|
NO
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
TSSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
6.1 mm
|
6.1 mm
|
| Base Number Matches |
1
|
5
|
| Manufacturer Package Code |
|
PAG56
|
| Clock Frequency-Max (fCLK) |
|
50 MHz
|
| Memory IC Type |
|
OTHER FIFO
|
| Package Equivalence Code |
|
TSSOP56,.3,20
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Standby Current-Max |
|
0.015 A
|
| Supply Current-Max |
|
0.15 mA
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare 7284L12PAGI with alternatives
Compare 7284L12PAG with alternatives