72821L25PFGI8
vs
IDT72821L10TF
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Package Description
TQFP-64
SLIM, TQFP-64
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
15 ns
6.5 ns
Cycle Time
25 ns
10 ns
JESD-30 Code
S-PQFP-G64
S-PQFP-G64
Length
14 mm
10 mm
Memory Density
18432 bit
9216 bit
Memory Width
9
9
Number of Functions
1
2
Number of Terminals
64
64
Number of Words
2048 words
1024 words
Number of Words Code
2000
1000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
2KX9
1KX9
Output Enable
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LQFP
LFQFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE
FLATPACK, LOW PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Seated Height-Max
1.6 mm
1.6 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.8 mm
0.5 mm
Terminal Position
QUAD
QUAD
Width
14 mm
10 mm
Base Number Matches
2
6
Pbfree Code
Rohs Code
Part Package Code
QFP
Pin Count
64
Clock Frequency-Max (fCLK)
100 MHz
JESD-609 Code
e0
Memory IC Type
OTHER FIFO
Moisture Sensitivity Level
3
Package Equivalence Code
QFP64,.47SQ,20
Peak Reflow Temperature (Cel)
240
Qualification Status
Not Qualified
Standby Current-Max
0.01 A
Supply Current-Max
0.06 mA
Terminal Finish
TIN LEAD
Time@Peak Reflow Temperature-Max (s)
30
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