72805LB10BGG
vs
IDT72805LB10PF9
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
BGA
QFP
Package Description
BGA,
LFQFP,
Pin Count
121
128
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
6.5 ns
6.5 ns
Cycle Time
10 ns
10 ns
JESD-30 Code
S-PBGA-B121
R-PQFP-G128
JESD-609 Code
e3
e0
Length
15 mm
20 mm
Memory Density
4608 bit
4608 bit
Memory Width
18
18
Number of Functions
2
1
Number of Terminals
121
128
Number of Words
256 words
256 words
Number of Words Code
256
256
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
256X18
256X18
Output Enable
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LFQFP
Package Shape
SQUARE
RECTANGULAR
Package Style
GRID ARRAY
FLATPACK, LOW PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.5 mm
1.6 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
MATTE TIN
Tin/Lead (Sn/Pb)
Terminal Form
BALL
GULL WING
Terminal Pitch
1.27 mm
0.5 mm
Terminal Position
BOTTOM
QUAD
Width
15 mm
14 mm
Base Number Matches
1
1
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare 72805LB10BGG with alternatives
Compare IDT72805LB10PF9 with alternatives