72421L15JG8
vs
IDT72421L15JG
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Package Description
LCC-32
QCCJ, LDCC32,.5X.6
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
10 ns
10 ns
Cycle Time
15 ns
15 ns
JESD-30 Code
R-PLCC-J32
R-PQCC-J32
Memory Density
576 bit
576 bit
Memory IC Type
OTHER FIFO
OTHER FIFO
Memory Width
9
9
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
64 words
64 words
Number of Words Code
64
64
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
64X9
64X9
Output Characteristics
3-STATE
3-STATE
Output Enable
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Parallel/Serial
PARALLEL
PARALLEL
Standby Current-Max
0.005 A
0.005 A
Supply Current-Max
0.035 mA
0.035 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
J BEND
J BEND
Terminal Position
QUAD
QUAD
Base Number Matches
1
1
Pbfree Code
Yes
Rohs Code
Yes
Part Package Code
QFJ
Pin Count
32
Clock Frequency-Max (fCLK)
66.7 MHz
JESD-609 Code
e3
Length
13.97 mm
Moisture Sensitivity Level
3
Package Code
QCCJ
Package Equivalence Code
LDCC32,.5X.6
Package Style
CHIP CARRIER
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Seated Height-Max
3.5 mm
Terminal Finish
Matte Tin (Sn) - annealed
Terminal Pitch
1.27 mm
Time@Peak Reflow Temperature-Max (s)
30
Width
11.43 mm
Compare 72421L15JG8 with alternatives
Compare IDT72421L15JG with alternatives