72401L35DGB vs 74HC7403N,112 feature comparison

72401L35DGB Integrated Device Technology Inc

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74HC7403N,112 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC NXP SEMICONDUCTORS
Package Description DIP-16 PLASTIC, SOT-38Z, DIP-16
Reach Compliance Code compliant compliant
ECCN Code EAR99
HTS Code 8542.32.00.71 8542.39.00.01
Clock Frequency-Max (fCLK) 35 MHz 12 MHz
JESD-30 Code R-CDIP-T16 R-PDIP-T16
Memory Density 256 bit 256 bit
Memory IC Type OTHER FIFO OTHER FIFO
Memory Width 4 4
Number of Functions 1 1
Number of Terminals 16 16
Number of Words 64 words 64 words
Number of Words Code 64 64
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Organization 64X4 64X4
Output Enable NO YES
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP16,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 Class B
Supply Current-Max 0.045 mA 0.001 mA
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 4.5 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 1 1
Part Package Code DIP
Pin Count 16
Manufacturer Package Code SOT38-4
Factory Lead Time 4 Weeks
Access Time-Max 98 ns
Additional Feature REGISTER BASED; BUBBLE BACK 2.7US
Cycle Time 83.33 ns
JESD-609 Code e4
Length 21.6 mm
Output Characteristics 3-STATE
Seated Height-Max 4.7 mm
Terminal Finish NICKEL PALLADIUM GOLD
Width 7.62 mm

Compare 72401L35DGB with alternatives

Compare 74HC7403N,112 with alternatives