723634L30PF
vs
72V3634L20PF
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.71
|
8542.32.00.71
|
| Access Time-Max |
15 ns
|
12 ns
|
| Clock Frequency-Max (fCLK) |
33.4 MHz
|
50 MHz
|
| JESD-30 Code |
R-PQFP-G128
|
R-PQFP-G128
|
| JESD-609 Code |
e0
|
e0
|
| Memory Density |
36864 bit
|
36864 bit
|
| Memory IC Type |
BI-DIRECTIONAL FIFO
|
BI-DIRECTIONAL FIFO
|
| Memory Width |
36
|
36
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Terminals |
128
|
128
|
| Number of Words |
1024 words
|
1024 words
|
| Number of Words Code |
1000
|
1000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
1KX36
|
1KX36
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QFP
|
QFP
|
| Package Equivalence Code |
QFP128,.63X.87,20
|
QFP128,.63X.87,20
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Peak Reflow Temperature (Cel) |
225
|
225
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Nom (Vsup) |
5 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
Tin/Lead (Sn85Pb15)
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
No
|
| Part Package Code |
|
TQFP
|
| Pin Count |
|
128
|
| Manufacturer Package Code |
|
PK128
|
| Standby Current-Max |
|
0.001 A
|
|
|
|
Compare 723634L30PF with alternatives
Compare 72V3634L20PF with alternatives