72251L15JGI
vs
IDT72V251L15JI8
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
PLCC
QFJ
Package Description
LCC-32
PLASTIC, LCC-32
Pin Count
32
32
Manufacturer Package Code
PLG32
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Date Of Intro
1992-01-01
Access Time-Max
10 ns
10 ns
Cycle Time
15 ns
15 ns
JESD-30 Code
R-PLCC-J32
R-PQCC-J32
JESD-609 Code
e3
e0
Memory Density
73728 bit
73728 bit
Memory IC Type
OTHER FIFO
OTHER FIFO
Memory Width
9
9
Moisture Sensitivity Level
3
1
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
8KX9
8KX9
Output Characteristics
3-STATE
Output Enable
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
225
Qualification Status
Not Qualified
Not Qualified
Standby Current-Max
0.005 A
0.005 A
Supply Current-Max
0.05 mA
0.02 mA
Supply Voltage-Max (Vsup)
5.5 V
3.6 V
Supply Voltage-Min (Vsup)
4.5 V
3 V
Supply Voltage-Nom (Vsup)
5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Matte Tin (Sn) - annealed
Tin/Lead (Sn85Pb15)
Terminal Form
J BEND
J BEND
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
20
Base Number Matches
2
1
Clock Frequency-Max (fCLK)
66.7 MHz
Length
13.9954 mm
Package Code
QCCJ
Package Equivalence Code
LDCC32,.5X.6
Package Style
CHIP CARRIER
Seated Height-Max
3.55 mm
Terminal Pitch
1.27 mm
Width
11.4554 mm
Compare 72251L15JGI with alternatives
Compare IDT72V251L15JI8 with alternatives