72245LB25PF
vs
72245LB25PF9
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
TQFP
QFP
Package Description
PLASTIC, TQFP-64
PLASTIC, TQFP-64
Pin Count
64
64
Manufacturer Package Code
PN64
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
15 ns
50 ns
Clock Frequency-Max (fCLK)
40 MHz
Cycle Time
25 ns
65 ns
JESD-30 Code
S-PQFP-G64
S-PQFP-G64
JESD-609 Code
e0
e0
Length
14 mm
14 mm
Memory Density
73728 bit
147456 bit
Memory IC Type
OTHER FIFO
OTHER FIFO
Memory Width
18
9
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
64
64
Number of Words
4096 words
4096 words
Number of Words Code
4000
16000
Operating Mode
SYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
4KX18
16KX9
Output Enable
YES
NO
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LQFP
LQFP
Package Equivalence Code
QFP64,.66SQ,32
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE
FLATPACK, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
240
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
1.6 mm
Standby Current-Max
0.005 A
Supply Current-Max
0.06 mA
0.12 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
NOT SPECIFIED
Width
14 mm
14 mm
Base Number Matches
20
2
Compare 72245LB25PF with alternatives
Compare 72245LB25PF9 with alternatives