72241L15JGI8 vs 72V241L15JG8 feature comparison

72241L15JGI8 Integrated Device Technology Inc

Buy Now Datasheet

72V241L15JG8 Integrated Device Technology Inc

Buy Now Datasheet
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Package Description LCC-32 QCCJ,
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 10 ns 10 ns
Cycle Time 15 ns 15 ns
JESD-30 Code R-PLCC-J32 R-PQCC-J32
Memory Density 36864 bit 36864 bit
Memory IC Type OTHER FIFO
Memory Width 9 9
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 4096 words 4096 words
Number of Words Code 4000 4000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 4KX9 4KX9
Output Characteristics 3-STATE
Output Enable YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Parallel/Serial PARALLEL PARALLEL
Standby Current-Max 0.005 A
Supply Current-Max 0.035 mA
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 4.5 V 3 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form J BEND J BEND
Terminal Position QUAD QUAD
Base Number Matches 1 1
Rohs Code Yes
JESD-609 Code e3
Length 13.9954 mm
Moisture Sensitivity Level 3
Package Code QCCJ
Package Style CHIP CARRIER
Peak Reflow Temperature (Cel) 260
Seated Height-Max 3.556 mm
Terminal Finish Matte Tin (Sn) - annealed
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 11.4554 mm

Compare 72241L15JGI8 with alternatives

Compare 72V241L15JG8 with alternatives