72235LB25PFG vs 72235LB25PF9 feature comparison

72235LB25PFG Integrated Device Technology Inc

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72235LB25PF9 Integrated Device Technology Inc

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFP QFP
Package Description TQFP-64 PLASTIC, TQFP-64
Pin Count 64 64
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 15 ns 50 ns
Cycle Time 25 ns 65 ns
JESD-30 Code R-PQFP-G64 S-PQFP-G64
JESD-609 Code e3 e0
Memory Density 36864 bit 73728 bit
Memory IC Type OTHER FIFO OTHER FIFO
Memory Width 18 9
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 64 64
Number of Words 2048 words 2048 words
Number of Words Code 2000 8000
Operating Mode SYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 2KX18 8KX9
Output Enable YES NO
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR SQUARE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.005 A
Supply Current-Max 0.06 mA 0.12 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Matte Tin (Sn) - annealed Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Base Number Matches 8 2
Length 14 mm
Package Code LQFP
Package Style FLATPACK, LOW PROFILE
Seated Height-Max 1.6 mm
Terminal Pitch 0.8 mm
Width 14 mm

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