72235LB15TFGI8 vs 72235LB15TFI8 feature comparison

72235LB15TFGI8 Integrated Device Technology Inc

Buy Now Datasheet

72235LB15TFI8 Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code TQFP TQFP
Package Description STQFP-64 PLASTIC, STQFP-64
Pin Count 64 64
Manufacturer Package Code PPG64 PP64
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Date Of Intro 1992-01-01
Access Time-Max 10 ns 10 ns
Cycle Time 15 ns 15 ns
JESD-30 Code R-PQFP-G64 S-PQFP-G64
JESD-609 Code e3 e0
Memory Density 36864 bit 36864 bit
Memory IC Type OTHER FIFO OTHER FIFO
Memory Width 18 18
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 64 64
Number of Words 2048 words 2048 words
Number of Words Code 2000 2000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 2KX18 2KX18
Output Enable YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR SQUARE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 240
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.005 A 0.005 A
Supply Current-Max 0.06 mA 0.06 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish MATTE TIN TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Base Number Matches 2 1
Clock Frequency-Max (fCLK) 66.7 MHz
Length 10 mm
Package Code LFQFP
Package Equivalence Code QFP64,.47SQ,20
Package Style FLATPACK, LOW PROFILE, FINE PITCH
Seated Height-Max 1.6 mm
Terminal Pitch 0.5 mm
Width 10 mm

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