72231L10PFSCDS-W vs IDT72231L10L feature comparison

72231L10PFSCDS-W Integrated Device Technology Inc

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IDT72231L10L Integrated Device Technology Inc

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 6.5 ns 6.5 ns
Clock Frequency-Max (fCLK) 100 MHz
Cycle Time 10 ns 10 ns
JESD-30 Code S-PQFP-G32 R-CQCC-N32
JESD-609 Code e0 e0
Memory Density 18432 bit 18432 bit
Memory IC Type OTHER FIFO
Memory Width 9 9
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 2048 words 2048 words
Number of Words Code 2000 2000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 2KX9 2KX9
Output Enable YES YES
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code QFP QCCN
Package Equivalence Code QFP32,.35SQ,32
Package Shape SQUARE RECTANGULAR
Package Style FLATPACK CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.005 A
Supply Current-Max 0.05 mA
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn85Pb15) TIN LEAD
Terminal Form GULL WING NO LEAD
Terminal Pitch 0.8 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 20
Base Number Matches 1 1
Part Package Code QFJ
Package Description CERAMIC, LCC-32
Pin Count 32
Length 13.97 mm
Output Characteristics 3-STATE
Seated Height-Max 3.048 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Width 11.43 mm

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