72225LB10PFG8
vs
72V225L10PFG
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
TQFP
TQFP
Package Description
TQFP-64
TQFP-64
Pin Count
64
64
Manufacturer Package Code
PNG64
PNG64
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Date Of Intro
1992-01-01
1992-01-01
Access Time-Max
6.5 ns
6.5 ns
Cycle Time
10 ns
10 ns
JESD-30 Code
R-PQFP-G64
S-PQFP-G64
JESD-609 Code
e3
e3
Memory Density
18432 bit
18432 bit
Memory IC Type
OTHER FIFO
OTHER FIFO
Memory Width
18
18
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
64
64
Number of Words
1024 words
1024 words
Number of Words Code
1000
1000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
1KX18
1KX18
Output Enable
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
SQUARE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
Standby Current-Max
0.005 A
0.005 A
Supply Current-Max
0.06 mA
0.03 mA
Supply Voltage-Max (Vsup)
5.5 V
3.6 V
Supply Voltage-Min (Vsup)
4.5 V
3 V
Supply Voltage-Nom (Vsup)
5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
MATTE TIN
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
30
Base Number Matches
2
4
Additional Feature
EASILY EXPANDABLE IN DEPTH AND WIDTH
Clock Frequency-Max (fCLK)
100 MHz
Length
14 mm
Package Code
LQFP
Package Equivalence Code
QFP64,.66SQ,32
Package Style
FLATPACK, LOW PROFILE
Seated Height-Max
1.6 mm
Terminal Pitch
0.8 mm
Width
14 mm
Compare 72225LB10PFG8 with alternatives
Compare 72V225L10PFG with alternatives