72225LB10PFG8 vs 72225LB10TF9 feature comparison

72225LB10PFG8 Integrated Device Technology Inc

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72225LB10TF9 Integrated Device Technology Inc

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code TQFP QFP
Package Description TQFP-64 LFQFP,
Pin Count 64 64
Manufacturer Package Code PNG64
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Date Of Intro 1992-01-01
Access Time-Max 6.5 ns 40 ns
Cycle Time 10 ns 50 ns
JESD-30 Code R-PQFP-G64 S-PQFP-G64
JESD-609 Code e3 e0
Memory Density 18432 bit 36864 bit
Memory IC Type OTHER FIFO OTHER FIFO
Memory Width 18 9
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 64 64
Number of Words 1024 words 1024 words
Number of Words Code 1000 4000
Operating Mode SYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 1KX18 4KX9
Output Enable YES NO
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR SQUARE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.005 A
Supply Current-Max 0.06 mA 0.15 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish MATTE TIN TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30
Base Number Matches 2 2
Length 10 mm
Package Code LFQFP
Package Style FLATPACK, LOW PROFILE, FINE PITCH
Seated Height-Max 1.6 mm
Terminal Pitch 0.5 mm
Width 10 mm

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