72225LB10J8
vs
72225LB10PF9
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
PLCC
QFP
Package Description
PLASTIC, LCC-68
LQFP,
Pin Count
68
64
Manufacturer Package Code
PL68
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
6.5 ns
40 ns
Clock Frequency-Max (fCLK)
100 MHz
Cycle Time
10 ns
50 ns
JESD-30 Code
S-PQCC-J68
S-PQFP-G64
JESD-609 Code
e0
e0
Length
24.2062 mm
14 mm
Memory Density
18432 bit
36864 bit
Memory IC Type
OTHER FIFO
OTHER FIFO
Memory Width
18
9
Moisture Sensitivity Level
1
3
Number of Functions
1
1
Number of Terminals
68
64
Number of Words
1024 words
1024 words
Number of Words Code
1000
4000
Operating Mode
SYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
1KX18
4KX9
Output Enable
YES
NO
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
LQFP
Package Equivalence Code
LDCC68,1.0SQ
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER
FLATPACK, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
225
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.572 mm
1.6 mm
Standby Current-Max
0.005 A
Supply Current-Max
0.06 mA
0.15 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
J BEND
GULL WING
Terminal Pitch
1.27 mm
0.8 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
20
NOT SPECIFIED
Width
24.2062 mm
14 mm
Base Number Matches
1
1
Compare 72225LB10J8 with alternatives
Compare 72225LB10PF9 with alternatives