72215LB15TFI9 vs 72215LB15J8 feature comparison

72215LB15TFI9 Integrated Device Technology Inc

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72215LB15J8 Integrated Device Technology Inc

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFP PLCC
Package Description PLASTIC, STQFP-64 PLASTIC, LCC-68
Pin Count 64 68
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 40 ns 10 ns
Cycle Time 50 ns 15 ns
JESD-30 Code S-PQFP-G64 S-PQCC-J68
JESD-609 Code e0 e0
Length 10 mm 24.2062 mm
Memory Density 36864 bit 9216 bit
Memory IC Type OTHER FIFO OTHER FIFO
Memory Width 9 18
Moisture Sensitivity Level 3 1
Number of Functions 1 1
Number of Terminals 64 68
Number of Words 512 words 512 words
Number of Words Code 4000 512
Operating Mode ASYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 4KX9 512X18
Output Enable NO YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP QCCJ
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 4.572 mm
Supply Current-Max 0.15 mA 0.06 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING J BEND
Terminal Pitch 0.5 mm 1.27 mm
Terminal Position QUAD QUAD
Width 10 mm 24.2062 mm
Base Number Matches 2 2
Manufacturer Package Code PL68
Clock Frequency-Max (fCLK) 66.7 MHz
Package Equivalence Code LDCC68,1.0SQ
Peak Reflow Temperature (Cel) 225
Standby Current-Max 0.005 A
Time@Peak Reflow Temperature-Max (s) 20

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