72215LB15TFGI8
vs
IDT72215LB15TFG
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
QFP
QFP
Package Description
,
LFQFP, QFP64,.47SQ,20
Pin Count
64
64
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
10 ns
10 ns
Cycle Time
15 ns
15 ns
JESD-30 Code
R-PQFP-G64
S-PQFP-G64
JESD-609 Code
e3
e3
Memory Density
9216 bit
9216 bit
Memory IC Type
OTHER FIFO
OTHER FIFO
Memory Width
18
18
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
64
64
Number of Words
512 words
512 words
Number of Words Code
512
512
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
512X18
512X18
Output Enable
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
SQUARE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Standby Current-Max
0.005 A
0.005 A
Supply Current-Max
0.06 mA
0.06 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
MATTE TIN
Matte Tin (Sn) - annealed
Terminal Form
GULL WING
GULL WING
Terminal Position
QUAD
QUAD
Base Number Matches
1
1
Clock Frequency-Max (fCLK)
66.7 MHz
Length
10 mm
Package Code
LFQFP
Package Equivalence Code
QFP64,.47SQ,20
Package Style
FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
Seated Height-Max
1.6 mm
Terminal Pitch
0.5 mm
Time@Peak Reflow Temperature-Max (s)
30
Width
10 mm
Compare 72215LB15TFGI8 with alternatives
Compare IDT72215LB15TFG with alternatives