72215LB15TFG vs IDT72V215L15TFG8 feature comparison

72215LB15TFG Integrated Device Technology Inc

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IDT72V215L15TFG8 Integrated Device Technology Inc

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFP QFP
Package Description STQFP-64 LFQFP,
Pin Count 64 64
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 10 ns 10 ns
Cycle Time 15 ns 15 ns
JESD-30 Code R-PQFP-G64 S-PQFP-G64
JESD-609 Code e3 e3
Memory Density 9216 bit 9216 bit
Memory IC Type OTHER FIFO
Memory Width 18 18
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 64 64
Number of Words 512 words 512 words
Number of Words Code 512 512
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 512X18 512X18
Output Enable YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR SQUARE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.005 A
Supply Current-Max 0.06 mA
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 4.5 V 3 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Matte Tin (Sn) - annealed MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30
Base Number Matches 1 1
Additional Feature EASILY EXPANDABLE IN DEPTH AND WIDTH
Length 10 mm
Package Code LFQFP
Package Style FLATPACK, LOW PROFILE, FINE PITCH
Seated Height-Max 1.6 mm
Terminal Pitch 0.5 mm
Width 10 mm

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Compare IDT72V215L15TFG8 with alternatives