72211L25JI vs 72211L25PF feature comparison

72211L25JI Integrated Device Technology Inc

Buy Now Datasheet

72211L25PF Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code PLCC TQFP
Package Description PLASTIC, LCC-32 TQFP-32
Pin Count 32 32
Manufacturer Package Code PL32 PR32
Reach Compliance Code not_compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 15 ns 15 ns
Clock Frequency-Max (fCLK) 40 MHz 40 MHz
Cycle Time 25 ns 25 ns
JESD-30 Code R-PQCC-J32 S-PQFP-G32
JESD-609 Code e0 e0
Length 13.9954 mm 7 mm
Memory Density 4608 bit 4608 bit
Memory IC Type OTHER FIFO OTHER FIFO
Memory Width 9 9
Moisture Sensitivity Level 1 3
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 512 words 512 words
Number of Words Code 512 512
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 512X9 512X9
Output Enable YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ LQFP
Package Equivalence Code LDCC32,.5X.6 QFP32,.35SQ,32
Package Shape RECTANGULAR SQUARE
Package Style CHIP CARRIER FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 225 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.556 mm 1.6 mm
Standby Current-Max 0.005 A 0.08 A
Supply Current-Max 0.035 mA 0.08 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form J BEND GULL WING
Terminal Pitch 1.27 mm 0.8 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 20 20
Width 11.4554 mm 7 mm
Base Number Matches 6 22

Compare 72211L25JI with alternatives

Compare 72211L25PF with alternatives