72205LB25TFG8
vs
72205LB25TFI9
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
,
|
PLASTIC, STQFP-64
|
| Pin Count |
64
|
64
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.71
|
8542.32.00.71
|
| Access Time-Max |
15 ns
|
50 ns
|
| Cycle Time |
25 ns
|
65 ns
|
| JESD-30 Code |
R-PQFP-G64
|
S-PQFP-G64
|
| JESD-609 Code |
e3
|
e0
|
| Memory Density |
4608 bit
|
36864 bit
|
| Memory IC Type |
OTHER FIFO
|
OTHER FIFO
|
| Memory Width |
18
|
9
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
64
|
64
|
| Number of Words |
256 words
|
256 words
|
| Number of Words Code |
256
|
4000
|
| Operating Mode |
SYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
256X18
|
4KX9
|
| Output Enable |
YES
|
NO
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Standby Current-Max |
0.005 A
|
|
| Supply Current-Max |
0.06 mA
|
0.15 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Position |
QUAD
|
QUAD
|
| Base Number Matches |
1
|
1
|
| Length |
|
10 mm
|
| Package Code |
|
LFQFP
|
| Package Style |
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| Seated Height-Max |
|
1.6 mm
|
| Terminal Pitch |
|
0.5 mm
|
| Width |
|
10 mm
|
|
|
|
Compare 72205LB25TFG8 with alternatives
Compare 72205LB25TFI9 with alternatives