7204L20JG
vs
7204L20TDBG
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
QFJ
DIP
Package Description
GREEN, PLASTIC, LCC-32
DIP,
Pin Count
32
28
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
20 ns
20 ns
Additional Feature
RETRANSMIT
RETRANSMIT
Cycle Time
30 ns
30 ns
JESD-30 Code
R-PQCC-J32
R-GDIP-T28
JESD-609 Code
e3
e3
Length
13.9954 mm
37.1475 mm
Memory Density
36864 bit
36864 bit
Memory Width
9
9
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
32
28
Number of Words
4096 words
4096 words
Number of Words Code
4000
4000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
4KX9
4KX9
Output Enable
NO
NO
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
QCCJ
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.556 mm
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
Matte Tin (Sn) - annealed
MATTE TIN
Terminal Form
J BEND
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
QUAD
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
11.4554 mm
7.62 mm
Base Number Matches
7
2
Screening Level
MIL-STD-883 Class B
Compare 7204L20JG with alternatives
Compare 7204L20TDBG with alternatives