7204L20JG vs 7204L20JG8 feature comparison

7204L20JG Integrated Device Technology Inc

Buy Now Datasheet

7204L20JG8 Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFJ QFJ
Package Description GREEN, PLASTIC, LCC-32 PLASTIC, LCC-32
Pin Count 32 32
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 20 ns 20 ns
Additional Feature RETRANSMIT RETRANSMIT
Cycle Time 30 ns 30 ns
JESD-30 Code R-PQCC-J32 R-PQCC-J32
JESD-609 Code e3 e3
Length 13.9954 mm 13.97 mm
Memory Density 36864 bit 36864 bit
Memory Width 9 9
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 4096 words 4096 words
Number of Words Code 4000 4000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 4KX9 4KX9
Output Enable NO NO
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.556 mm 3.55 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Width 11.4554 mm 11.43 mm
Base Number Matches 7 2

Compare 7204L20JG with alternatives

Compare 7204L20JG8 with alternatives