7203L50TDB vs IDT7203S50XEB feature comparison

7203L50TDB Integrated Device Technology Inc

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IDT7203S50XEB Integrated Device Technology Inc

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code DIP DFP
Package Description CERAMIC, DIP-28 CERPACK-28
Pin Count 28 28
Reach Compliance Code not_compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 50 ns 50 ns
Clock Frequency-Max (fCLK) 15 MHz 15 MHz
Cycle Time 65 ns 65 ns
JESD-30 Code R-CDIP-T28 R-GDFP-F28
JESD-609 Code e0 e0
Memory Density 18432 bit 18432 bit
Memory IC Type OTHER FIFO OTHER FIFO
Memory Width 9 9
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 2048 words 2048 words
Number of Words Code 2000 2000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 2KX9 2KX9
Output Enable NO NO
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
Package Code DIP DFP
Package Equivalence Code DIP28,.3 FL28,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE FLATPACK
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 Class B 38535Q/M;38534H;883B
Standby Current-Max 0.004 A 0.012 A
Supply Current-Max 0.15 mA 0.15 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE FLAT
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 1 1
Pbfree Code No
Additional Feature RETRANSMIT
Length 18.288 mm
Output Characteristics 3-STATE
Seated Height-Max 2.921 mm
Width 12.446 mm

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Compare IDT7203S50XEB with alternatives