7203L25JGI
vs
L8C203JC25
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
LOGIC DEVICES INC
Part Package Code
QFJ
QFJ
Package Description
QCCJ,
QCCJ, LDCC32,.5X.6
Pin Count
32
32
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
25 ns
25 ns
Additional Feature
RETRANSMIT
RETRANSMIT
Clock Frequency-Max (fCLK)
28.5 MHz
28.57 MHz
Cycle Time
35 ns
28.57 ns
JESD-30 Code
R-PQCC-J32
R-PQCC-J32
JESD-609 Code
e3
e0
Memory Density
18432 bit
18432 bit
Memory IC Type
OTHER FIFO
OTHER FIFO
Memory Width
9
9
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
2048 words
2048 words
Number of Words Code
2000
2000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
2KX9
2KX9
Output Characteristics
3-STATE
3-STATE
Output Enable
NO
NO
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
QCCJ
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
225
Qualification Status
Not Qualified
Not Qualified
Standby Current-Max
0.002 A
0.005 A
Supply Current-Max
0.12 mA
0.1 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
Matte Tin (Sn) - annealed
TIN LEAD
Terminal Form
J BEND
J BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
Base Number Matches
1
1
Length
13.97 mm
Package Equivalence Code
LDCC32,.5X.6
Seated Height-Max
3.556 mm
Width
11.43 mm
Compare 7203L25JGI with alternatives
Compare L8C203JC25 with alternatives