7203L15JGI8
vs
IDT7203S15TD
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
PLCC
|
DIP
|
| Pin Count |
32
|
28
|
| Manufacturer Package Code |
PLG32
|
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
NLR
|
EAR99
|
| HTS Code |
8542320071
|
8542.32.00.71
|
| Samacsys Manufacturer |
Renesas Electronics
|
|
| Access Time-Max |
15 ns
|
15 ns
|
| Clock Frequency-Max (fCLK) |
40 MHz
|
40 MHz
|
| Cycle Time |
25 ns
|
25 ns
|
| JESD-30 Code |
R-PQCC-J32
|
R-CDIP-T28
|
| JESD-609 Code |
e3
|
e0
|
| Length |
13.9954 mm
|
37.1475 mm
|
| Memory Density |
18432 bit
|
18432 bit
|
| Memory IC Type |
OTHER FIFO
|
OTHER FIFO
|
| Memory Width |
9
|
9
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
32
|
28
|
| Number of Words |
2048 words
|
2048 words
|
| Number of Words Code |
2000
|
2000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
2KX9
|
2KX9
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Enable |
NO
|
NO
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
QCCJ
|
DIP
|
| Package Equivalence Code |
LDCC32,.5X.6
|
DIP28,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
IN-LINE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.556 mm
|
5.08 mm
|
| Standby Current-Max |
0.012 A
|
0.008 A
|
| Supply Current-Max |
0.12 mA
|
0.12 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
J BEND
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
11.4554 mm
|
7.62 mm
|
| Base Number Matches |
1
|
1
|
| Package Description |
|
0.300 INCH, THIN, CERDIP-28
|
| Additional Feature |
|
RETRANSMIT
|
|
|
|
Compare 7203L15JGI8 with alternatives
Compare IDT7203S15TD with alternatives