7203L15D
vs
7203L15J
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
DIP
PLCC
Package Description
CERAMIC, DIP-28
PLASTIC, LCC-32
Pin Count
28
32
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
15 ns
15 ns
Clock Frequency-Max (fCLK)
40 MHz
40 MHz
Cycle Time
25 ns
25 ns
JESD-30 Code
R-CDIP-T28
R-PQCC-J32
JESD-609 Code
e0
e0
Length
37.2 mm
13.9954 mm
Memory Density
18432 bit
18432 bit
Memory IC Type
OTHER FIFO
OTHER FIFO
Memory Width
9
9
Number of Functions
1
1
Number of Terminals
28
32
Number of Words
2048 words
2048 words
Number of Words Code
2000
2000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
2KX9
2KX9
Output Enable
NO
NO
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
DIP
QCCJ
Package Equivalence Code
DIP28,.6
LDCC32,.5X.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
3.556 mm
Standby Current-Max
0.002 A
0.002 A
Supply Current-Max
0.12 mA
0.12 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
J BEND
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
QUAD
Width
15.24 mm
11.4554 mm
Base Number Matches
12
18
Pbfree Code
No
Manufacturer Package Code
PL32
Additional Feature
RETRANSMIT
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
225
Time@Peak Reflow Temperature-Max (s)
20
Compare 7203L15D with alternatives
Compare 7203L15J with alternatives