7202LA20DGB
vs
7202LA20PDGB
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Package Description
DIP, DIP28,.6
DIP, DIP28,.6
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
20 ns
20 ns
Clock Frequency-Max (fCLK)
33.3 MHz
33.3 MHz
JESD-30 Code
R-XDIP-T28
R-PDIP-T28
JESD-609 Code
e3
e3
Memory Density
9216 bit
9216 bit
Memory IC Type
OTHER FIFO
OTHER FIFO
Memory Width
9
9
Number of Terminals
28
28
Number of Words
1024 words
1024 words
Number of Words Code
1000
1000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
1KX9
1KX9
Package Body Material
CERAMIC
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP28,.6
DIP28,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883 Class B (Modified)
MIL-STD-883 Class B
Standby Current-Max
0.015 A
0.015 A
Supply Current-Max
0.1 mA
0.1 mA
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
MATTE TIN
Matte Tin (Sn) - annealed
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
Part Package Code
DIP
Pin Count
28
Additional Feature
RETRANSMIT
Cycle Time
30 ns
Length
36.576 mm
Moisture Sensitivity Level
1
Number of Functions
1
Output Enable
NO
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
260
Seated Height-Max
4.699 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Time@Peak Reflow Temperature-Max (s)
30
Width
15.24 mm
Compare 7202LA20DGB with alternatives
Compare 7202LA20PDGB with alternatives