7202LA12JG8
vs
7202LA12JG
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
PLCC
|
PLCC
|
Package Description |
PLASTIC, LCC-32
|
GREEN, PLASTIC, LCC-32
|
Pin Count |
32
|
32
|
Manufacturer Package Code |
PLG32
|
PLG32
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
NLR
|
EAR99
|
HTS Code |
8542320071
|
8542.32.00.71
|
Factory Lead Time |
18 Weeks
|
|
Samacsys Manufacturer |
Renesas Electronics
|
|
Access Time-Max |
12 ns
|
12 ns
|
Additional Feature |
RETRANSMIT
|
RETRANSMIT
|
Clock Frequency-Max (fCLK) |
50 MHz
|
50 MHz
|
Cycle Time |
20 ns
|
20 ns
|
JESD-30 Code |
R-PQCC-J32
|
R-PQCC-J32
|
JESD-609 Code |
e3
|
e3
|
Length |
13.97 mm
|
13.97 mm
|
Memory Density |
9216 bit
|
9216 bit
|
Memory IC Type |
OTHER FIFO
|
OTHER FIFO
|
Memory Width |
9
|
9
|
Moisture Sensitivity Level |
3
|
3
|
Number of Functions |
1
|
1
|
Number of Terminals |
32
|
32
|
Number of Words |
1024 words
|
1024 words
|
Number of Words Code |
1000
|
1000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
1KX9
|
1KX9
|
Output Enable |
NO
|
NO
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
QCCJ
|
Package Equivalence Code |
LDCC32,.5X.6
|
LDCC32,.5X.6
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
3.55 mm
|
3.55 mm
|
Standby Current-Max |
0.005 A
|
0.005 A
|
Supply Current-Max |
0.08 mA
|
0.08 mA
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
Matte Tin (Sn) - annealed
|
Matte Tin (Sn) - annealed
|
Terminal Form |
J BEND
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
11.43 mm
|
11.43 mm
|
Base Number Matches |
1
|
4
|
Date Of Intro |
|
1988-01-01
|
|
|
|
Compare 7202LA12JG8 with alternatives
Compare 7202LA12JG with alternatives