7201SA50TCB vs L8C201PC50 feature comparison

7201SA50TCB Integrated Device Technology Inc

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L8C201PC50 LOGIC Devices Inc

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC LOGIC DEVICES INC
Package Description DIP, DIP28,.3 DIP,
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 50 ns 50 ns
Cycle Time 65 ns 65 ns
JESD-30 Code R-XDIP-T28 R-PDIP-T28
JESD-609 Code e0
Memory Density 4608 bit 4608 bit
Memory IC Type OTHER FIFO OTHER FIFO
Memory Width 9 9
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 512 words 512 words
Number of Words Code 512 512
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 512X9 512X9
Output Enable NO NO
Package Body Material CERAMIC PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP28,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level 38535Q/M;38534H;883B
Supply Current-Max 0.14 mA 0.08 mA
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 1 1
Part Package Code DIP
Pin Count 28
Additional Feature RETRANSMIT
Length 35.052 mm
Moisture Sensitivity Level 3
Output Characteristics 3-STATE
Peak Reflow Temperature (Cel) 225
Seated Height-Max 4.572 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Width 7.62 mm

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