7201LA50TDGB vs IDT7201LA50LGB feature comparison

7201LA50TDGB Integrated Device Technology Inc

Buy Now Datasheet

IDT7201LA50LGB Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Package Description DIP, DIP28,.3 QCCN, LCC32,.45X.55
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 50 ns 50 ns
Clock Frequency-Max (fCLK) 15 MHz 15 MHz
JESD-30 Code R-XDIP-T28 R-CQCC-N32
JESD-609 Code e3 e3
Memory IC Type OTHER FIFO OTHER FIFO
Memory Width 9 9
Number of Terminals 28 32
Number of Words 512 words 512 words
Number of Words Code 512 512
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 512X9 512X9
Package Body Material CERAMIC CERAMIC, METAL-SEALED COFIRED
Package Code DIP QCCN
Package Equivalence Code DIP28,.3 LCC32,.45X.55
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE CHIP CARRIER
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.015 A 0.015 A
Supply Current-Max 0.1 mA 0.1 mA
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish MATTE TIN MATTE TIN
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL QUAD
Base Number Matches 1 1
Part Package Code QFJ
Pin Count 32
Additional Feature RETRANSMIT
Cycle Time 65 ns
Length 13.97 mm
Memory Density 4608 bit
Number of Functions 1
Output Enable NO
Parallel/Serial PARALLEL
Screening Level MIL-STD-883 Class B
Seated Height-Max 3.048 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Width 11.43 mm

Compare 7201LA50TDGB with alternatives

Compare IDT7201LA50LGB with alternatives