7201LA50TDGB vs 7201LA50TPG feature comparison

7201LA50TDGB Integrated Device Technology Inc

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7201LA50TPG Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Package Description DIP, DIP28,.3 DIP, DIP28,.3
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 50 ns 50 ns
Clock Frequency-Max (fCLK) 15 MHz 15 MHz
JESD-30 Code R-XDIP-T28 R-PDIP-T28
JESD-609 Code e3 e3
Memory IC Type OTHER FIFO OTHER FIFO
Memory Width 9 9
Number of Terminals 28 28
Number of Words 512 words 512 words
Number of Words Code 512 512
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 512X9 512X9
Package Body Material CERAMIC PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP28,.3 DIP28,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.015 A 0.005 A
Supply Current-Max 0.1 mA 0.08 mA
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Finish MATTE TIN MATTE TIN
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 1 1
Part Package Code DIP
Pin Count 28
Additional Feature RETRANSMIT
Cycle Time 65 ns
Length 34.671 mm
Memory Density 4608 bit
Number of Functions 1
Output Enable NO
Parallel/Serial PARALLEL
Seated Height-Max 4.572 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Width 7.62 mm

Compare 7201LA50TDGB with alternatives

Compare 7201LA50TPG with alternatives